Technical Specifications of the XiP Pro

XiP Pro provides industrial strength 3D printing in a compact size. XiP Pro is powered by our patented Lubricant Sublayer Photo-curing (LSPc) technology to accurately print at high speeds.

Technical Specifications

Print Technology Lubricant Sublayer Photo-curing (LSPc) Technology

Build Volume

X × Y × Z

292 mm ×  163 mm ×  410 mm

11.5” × 6.4” ×  16.1”

19.5 liters print volume (5.15 gallons)
Layer Thickness
  • Standard:
    • 50 µm, .002 in
    • 100 µm, .004 in
    • 200 µm, .008 in
  • Available to user via advanced settings:
    • 25µm - 200µm, .001 - .008 in
Material Compatibility Various resins: Nexa3D, Henkel, Keystone, BASF
Light Source Collimated LED array
High Resolution LCD 13.6”,  7K UV Monochrome
46 µm pixel pitch
Resin Fill

Manual Pour

Smart Resin Gravity Dispense
Input File Format .nxa
Software Bundle NexaX Pro
Supported File Types .stl, .obj, .3mf, .nxs
Operating Environment Indoor use only
Ambient Temperature 20-25˚C / 68-77˚F
Relative Humidity Below 70%
Power Requirements 100-240Vac, 50/60Hz 950W Max (8A Slow Blow Fuse)
Connectivity Wi-Fi, USB, Ethernet
Printer Weight 77 kg (170 pounds)

Printer Dimensions

W × D × H

622 mm x 447 mm x 895 mm

24.5” × 17.6” × 35.25”

 

XiP Pro Components

XiP Pro is modular in design for interchangeable parts. It consists of seven main components that users will interact with in order to operate the unit.

  1. Build Plate
    • Surface to print part on.
  2. Z-stage arm
    • Attachment of the Build Plate to the Z-stage
  3. Resin Vat with Spout
    • Contains resin and interface with cartridge.
  4. LCD Module
    • 7k UV LCD screen
  5. Touchscreen
    • Interactive user interface
  6. Resin Cartridge
    • Contains 1 kg of resin
  7. Resin Cartridge Chute
    • Resin cartridge Guide

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